Details

Project TitleCombustion Processing for Metal Oxide Thin-Film Electronics
Track Code2010-164
Short Description

A combustion processing method that eliminates the need for extreme heating and allows for the production of a variety of metal oxide thin films

#materials #electronic #semiconductor #thinfilm

Abstract

Production of larger electronics such as flat panel displays, sensor arrays, and flexible circuitry require low-cost, high-throughput manufacturing methods that are compatible with fabrication on a large surface. Conventional manufacturing using single-crystal silicon wafers is expensive and limiting for large areas and does not easily achieve optical transparency and mechanical flexibility in the resulting material. Oxide thin films on flexible substrates represent a feasible option for large-area production, but current methods are limited by the requirement for very high annealing temperatures. Northwestern inventors have developed a combustion processing method that eliminates the need for extreme heating and allows for the production of a variety of metal oxide thin films. These films can be applied to a variety of devices and are demonstrably effective in optically transparent transistors positioned on flexible plastic substrates.

 
TagsSEMICONDUCTOR: component, SEMICONDUCTOR: processing, MATERIALS: electronic, MATERIALS: thin film, MATERIALS: semiconductor
 
Posted DateSep 18, 2017 2:38 PM

Inventors

Antonio Facchetti
Mercouri G. Kanatzidis*
Tobin J. Marks*
He Yan
Myung-Gil Kim
William Christopher Sheets

Yu Xia

Applications

Production of large-area, flexible, optically transparent electronic components

Advantages

  • Cost effective
  • No extreme heating
  • Easily achieve mechanical flexibility and optical transparency

Publications

IP Status

A patent application has been filed.

Contact Information

Zachary Brown, PhD

Licensing Manager

(t) 847.491-5095

(e) zachary.brown@northwestern.edu